Principal Wireless SoC Architect(low power)

pulliShape the architecture of next-generation ultra-low-power wireless SoCs /liliJoin a world-class RD environment where you'll influence strategic technology /li /ul /brh3About Our Client /h3 /brpOur client is an innovative international semiconductor company developing ultra-low-power integrated circuits and wireless SoC solutions for IoT, medical, industrial, automotive and consumer applications based in Neuchatel. /p /brh3Job Description /h3 /brh3Your Responsibilities as a Principal Wireless SoC Architect (low power) /h3 /brulliDefine the end-to-end architecture of next-generation ultra-low-power wireless SoCs /liliDrive system-level architecture and hardware/software partitioning /liliLead technical alignment across RF, Analog, Digital, Firmware, Packaging and Validation teams /liliOptimise system performance, power consumption, cost and reliability /liliOversee SoC integration, including package and PCB considerations /liliContribute to the product roadmap and long-term technology strategy /liliSupport the full development lifecycle, from system requirements through validation and production qualification /liliAct as the technical authority for architectural decisions across international engineering teams /li /ul /brh3The Successful Applicant /h3 /brh3Your ideal Profile as a Principal Wireless SoC Architect (low power) /h3 /brulliDegree in Electrical Engineering, Microelectronics or Computer Engineering /liliMinimum 15 years of experience in bWireless SoC and RF CMOS architecture or design /b /liliProven track record of bringing low-power RF SoCs from concept to high-volume production /liliStrong expertise in: RF CMO, Wireless System Architecture, SoC Integration, Mixed-Signal Design, Power Management, System Partitioning /liliDeep understanding of bPower, Performance and Area /b for low-power semiconductor design /liliExperience with wireless communication protocols such as bBluetooth Low Energy (BLE), IEEE 802.15.4 /b, or equivalent technologies /liliExposure to advanced semiconductor process nodes (22nm and below) is an advantage /li /ul /brh3What's on Offer /h3 /brh3What You'll Find /h3 /brulliA highly innovative international semiconductor environment /liliThe opportunity to shape next-generation wireless SoC platforms /liliCollaboration with multidisciplinary RD teams across the globe /liliA strategic technical leadership position with high impact on future products /liliPosition based in bSwitzerland /b (on-site role in Neuchatel) /li /ul /p #J-18808-Ljbffr