Application Engineer - High Performance Liquid Cooling Solutions

We are looking for an experienced Application Engineer to be the primary technical partner for customers adopting our innovative liquid cooling products.

You will work directly with enterprise customers and our engineering team, translating real-world system requirements into deployment-ready solutions. This role requires sharp technical insight combined with exceptional communication to build strong partnerships. You will ensure our technology delivers clear and measurable performance benefits to our customers, directly contributing to the scaling of our high-performance solutions in complex thermal environments.

About apheros:

We are a startup pioneering metal foam-based cooling solutions for AI-data centers and more. Our materials are integrated into cooling solutions for both single and two-phase direct-to-chip liquid cooling - enabling better performance, hotspot management, and energy savings.

Our team is built on curiosity, collaboration, and a shared drive to craft a sustainable future - while having fun along the way! Our offices, labs, and pilot line are close to the train station in Baden, Switzerland, and fully stocked with coffee and cake.

Tasks

• Be the primary pre-sale technical lead for customers adopting our liquid cooling solutions, engaging deeply with the data center hardware ecosystem to understand detailed thermal and fluidic requirements
• Develop compelling technical use cases for our customers, as well as performance models that clearly highlight the value, efficiency, and Return on Investment (ROI) of our cooling solutions
• Drive proof-of-concept demonstrations and performance validations, showcasing how our solutions meet stringent thermal, fluidic, and operational requirements
• Collaborate closely with internal R&D and Engineering teams to ensure critical customer insights — spanning materials, thermal science, and high-performance computing needs — are accurately translated into product development
• Build and maintain strong customer relationships, acting as a trusted technical advisor who partners with clients to optimize their thermal performance and overall data center efficiency

Requirements

• 3- to 5-year experience as an application engineer, solutions engineer, or pre-sales role, specifically within data center, high-performance computing (HPC), or thermal management environments
• A strong technical understanding of liquid cooling systems and data center cooling requirements
• Excellent customer‑facing skills with a proven ability to build rapport and trust with engineers, systems architects, and executive decision‑makers
• The ability to translate customer application needs and requirements into clear, concise inputs for our Product Development and Engineering teams
• A pragmatic, collaborative, and adaptable mindset comfortable thriving in a fast-paced, startup environment focused on clear, measurable results

What sets you apart:

• You possess an advanced technical understanding (or degree) in thermal management, fluid dynamics, or data center infrastructure, enabling in-depth discussions about complex liquid cooling solutions
• You have a proven track record in technical sales - ideally in electronics hardware, HPC, or data center environments - with experience in driving customer adoption and leading technical sale cycles
• You genuinely care about customers’ pain points and translate them into concrete, fast-to-deploy cooling solutions
• You can work fluidly across R&D, Engineering, Product, and Marketing functions to achieve collective goals

Benefits

• High autonomy to drive product strategy and make a direct, meaningful impact on the company's trajectory and bottom line
• Complete technical ownership of cooling solutions, from initial customer concept and design to successful deployment and post-sales validation
• A commitment to mutual support, continuous learning, and direct, constructive feedback to help you develop and grow with the company
• Flexible work arrangements supporting work-life balance

At apheros AG, we are committed to fostering an inclusive and diverse workplace. We encourage applications from individuals of all backgrounds and fields of expertise.
Application deadline: January 31st, 2026

Due to the rapid growth of AI and high-performance computing, conventional air cooling is no longer sufficient. Direct-to-chip liquid cooling has emerged as the solution.

The apheros metal foam is positioned to keep the next-gen chips cool. They can be used in single- and two-phase DLC.

Beyond thermal performance, our materials excel in a wide range of applications, including green hydrogen production, energy storage, catalysis, high-temperature filtration, and more.